China Just Proved It Doesn't Need EUV. It Has Packaging.
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#tsmc #euvlithography #semiconductors Washington built the most sophisticated technology blockade in modern history to stop China from building advanced AI chips. Five years of export bans. ASML restrictions. EUV lithography cut off at the source. And China just walked around all of it. Not by catching up on transistors. By dominating the one part of the supply chain that was never sanctioned. Advanced packaging. In this episode, we break down the data nobody on US cable news is talking about. Why JCET, Tongfu, and Huatian now hold roughly 25% of global advanced packaging market share. Why every NVIDIA H100, every AMD MI350, every Google TPU on Earth depends on a chokepoint the West does not actually control. Why TSMC's own roadmap, with 6% generational density gains and 40-reticle SoW-X mega-chips by 2029, just confirmed that the entire AI revolution is now bottlenecked on packaging, not lithography. And why Huawei's Ascend 950, launching Q1 2026, is the first credible AI accelerator
Tags: chip war, china chip war, US china semiconductor, ASML restrictions, advanced packaging, CoWoS, JCET, TSMC packaging, China AI chips, US export controls, semiconductor sanctions, Huawei Ascend 950, Tongfu Microelectronics, chiplet integration, 2.5D packaging, NVIDIA H100 packaging, AMD MI350, SMIC 7nm, China semiconductor self-sufficiency, Quantum Silk Route
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