The Chip War Just Went Vertical — And Nobody Noticed
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Two of the biggest names in chips just made the exact same bet — and almost nobody noticed what it really means. IBM and Huawei both stopped trying to shrink transistors. They started stacking them. Here's why the chip war just changed direction. For sixty years, progress in semiconductors meant one thing: make the transistor smaller. That era is quietly ending. In a single month, IBM unveiled its new 3D "Nanostack" architecture at what it labels the 0.7nm (7 angstrom) node, and Huawei revealed a vertical-stacking design it calls "LogicFolding" — two rival approaches, from opposite sides of the US–China tech war, both betting that the future of computing is no longer flat. It's vertical. In this video we break down what the headlines got wrong about IBM's "0.7nm" announcement (the number isn't what most outlets claimed), why stacking matters more than shrinking, how Huawei is trying to route around the EUV lithography blockade, and what this shift means for Moore's Law, AI hardware, an
Tags: chip war, semiconductors, semiconductor, IBM, Huawei, IBM Nanostack, Nanostack, LogicFolding, Huawei LogicFolding, Moore's Law, Moore's Law ending, transistor, transistors, chip design, 3D chips, chip stacking, stacked transistors, vertical transistors, 0.7nm chip, 7 angstrom
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