Inside The Hidden Bottleneck In The AI Chip Boom
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Austrian technology company AT&S makes a little-known but increasingly important part of AI chips: IC substrates. These high-tech base layers sit beneath processors and memory, helping carry power and data between components inside advanced chip packages. Managing Asia goes inside AT&S’s manufacturing complex in Kulim, Malaysia, where the company is expanding capacity as demand grows. CEO Michael Mertin discusses the technology race, AT&S’s expansion plans, competition in the substrate market and how geopolitics is reshaping the semiconductor supply chain. Watch the interview on “Managing Asia with Christine Tan” in the video above. #CNBC #ManagingAsia #AT&S #AIChips #Semiconductors ----- Subscribe: @cnbci CNBC International Live: @cnbcinternationalive LinkedIn: https://www.linkedin.com/showcase/cnbc/ TikTok: https://www.tiktok.com/@cnbc Facebook: https://www.facebook.com/cnbc Instagram: https://www.instagram.com/cnbc Threads: https://www.threads.net/@cnbc X: https://twitt
Tags: CNBC, CNBC Explains, CNBC International, AT&S, Michael Mertin, Artificial intelligence, AI chips, Semiconductors, IC substrates, Printed circuit boards, Advanced packaging, Malaysia, Kulim, Austria, China, Supply chains, AMD, Managing Asia, christine tan, at&s ceo interview
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